Semi-Automatic Flip Chip/Die Bonder

The M-10 is a flexible and expandable flip chip/die bonding platform that fills the need for R&D and prototyping, as well as limited production runs of flip chip/die bonding applications. This competitively priced, versatile bonder can be purchased as a manual version and field-upgraded to grow to a fully automatic system including machine vision.

The PC-driven product has a placement accuracy of better than 2 micrometers and can handle dies from 200 micrometers to 150 mm. Substrate capacity is 150 mm (optional 200 mm). The machine can utilize the company's "ST" bond head (patent pending) for precision die bonding and the unique "SC" optical local alignment probe for final alignment.

Standard features include multiple leveling systems, rapid heaters (100°/second), gas reflow chambers, adhesive dispensers and ultrasonic bond heads. The system can pick up dies from waffle or gel packs, apply forces in the range of 10 grams to 50 kg, and apply temperatures of up to 500° C.

The diversity of the tool allows it to be used for applications such as hybrid MCM's, single chip packages, all adhesive and thermo compression applications as well as solder and eutectic reflow.

Besi Die Handling, 121 Ethel Road West, Piscataway, NJ 08854. Tel: 732-572-4800; Fax: 732-572-4808.