Product/Service

Bonded Fin Heat Sinks

Source: Melcor Corporation
The Melcor Thermal Solutions bonded fin heat sinks are designed specifically for our CP, ST, PT and HT Series thermoelectric devices
The Melcor Thermal Solutions bonded fin heat sinks are designed specifically for our CP, ST, PT and HT Series thermoelectric devices. These high performance heat sinks are ideal for fan forced convection and are available with fan mount brackets. Each bonded fin heat sink is part of a series of matching components designed to work together as a complete thermoelectric system. The HX8-401 and HX8-402 models have assembly holes for mounting two thermoelectric coolers.

Features

  • High fin density (up to 8 fins/inch)
  • Sensor hole for temperature monitoring
  • Optional fan mount bracket
  • Tapped or clearance assembly holes
  • Machined or solderable plated finish
  • English (#6-32) or Metric (M3) tapped holes

Melcor Corporation, 1040 Spruce Street, Trenton, NJ 08648. Tel: 609-393-4178; Fax: 609-393-9461.