Automated Flip Chip/Die Bonder

The CDB50-ST is a combination machine consisting of the company's (patent pending) "ST" technology. The new machine is capable of bonding Flip Chips as well as dies facing up in the same pass, achieving submicron placement accuracies (application dependent). The breakthrough technology utilizes a unique optical bond head in conjunction with a proprietary bonding scheme.

The machine can pick up dies as small as 200 microns from gel packs or waffle packs. The machine is geared toward multiple applications in optoelectronics, communication, high frequency devices, etc. For Eutectic bonding applications it can be equipped with an environmentally controlled reflow oven as an integral part of the machine for faster throughput. The machine can be delivered as a fully automatic magazine-to-magazine system or with manual substrate or boat loading.

Besi Die Handling, 121 Ethel Road West, Piscataway, NJ 08854. Tel: 732-572-4800; Fax: 732-572-4808.