About Us
Our GuideLink™ polymer waveguide product lines can help improve throughput in manufacturing, increase channel density, increase device density, decrease system costs and save on assembly costs.
Increased density
-OC PitchLink™Interconnect System can fit 440 multimode guides within an MT-ferrule footprint. That is the fiber-equivalent density of 36 single layer 1x12 MT-ferrules!
-OC PitchLink™ in-plane and out-of-plane bend radius is 5 mm versus 19 mm for standard multimode fiber. This allows the mechanical designer to decrease footprint and headroom requirements for devices by a factor of 4.
Decreased costs
-Higher density per connector translates to fewer connectors decreasing piece part costs significantly.
-Passive alignment and MT-ferrule interconnect system decrease assembly time in manufacturing.
-OC BoardLink™ designed backplanes eliminate fiber routing problems for board to board interconnect systems.
Introducing our OC ShuffleLink™ Product Line
Optical CrossLinks latest line of high density interconnects for the VSR market
-Our unique manufacturing process allows us to offer a mass-manufactured custom, perfect, or asymmetric shuffles in a super-small form factor.
-4, 8, 12, 16, 32 fiber ribbonizing capability
Optical Crosslinks, Inc.
500 North Walnut Road
Kennett Square, PA 19348
UNITED STATES
Phone: 610-444-9469
Fax: 610-444-9491
Contact: Bobi Gold

